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CM1402 SIM Card EMI Filter Array with ESD Protection
Features
* * * * * * * * * * Functionally and pin compatible with CMD's CSPEMI400 OptiGuardTM coated for improved reliability at assembly Three channels of EMI filtering, each with ESD protection Two additional channels of ESD-only protection 10kV ESD protection (IEC 61000-4-2, contact discharge) on all pins 25kV ESD protection (HBM) Greater than 30dB of attenuation at 1GHz 10-bump, 1.960mm x 1.330mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance Lead-free version available
Product Description
CAMD's CM1402 is an EMI filter array with ESD protection, which integrates three pi filters (C-R-C) and two additional channels of ESD protection. The CM1402 has component values of 20pF-47-20pF, and 20pF-100-20pF. The parts include avalanchetype ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of 10kV, beyond the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than 25kV. The ESD diodes on pins A4 and C4 ports are designed and characterized to safely dissipate ESD strikes of 10kV, well beyond the maximum requirement of the IEC 61000-4-2 international standard. This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easyto-use pin assignments. In particular, the CM1402 is ideal for EMI filtering and protecting data lines from ESD for the SIM card slot in mobile handsets. The CM1402 incorporates OptiGuardTM coating which results in improved reliability at assembly.The CM1402 is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing.
Applications
* * * SIM Card slot in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs, etc. EMI filtering for data ports in cell phones, PDAs or notebook computers
Electrical Schematic
R1 A1 C C GND R1 A3 C C C3 A4 C C C4 C1 A2 C C R2 C2
B1,B2
(c) 2005 California Micro Devices Corp. All rights reserved. 11/02/05
R1=100 R2=47
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
1
CM1402
PACKAGE / PINOUT DIAGRAMS
TOP VIEW (Bumps Down View)
Orientation Marking (see note 2)
BOTTOM VIEW (Bumps Up View)
Orientation Marking A4 A3 B2 C4 C3 C2 A2 B1 C1 A1
A1
1 A B C
2
3
4
CE
CM1402
CSP Package with OptiGuardTM Coating
Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
TYPE EMI Filter EMI Filter Device Ground EMI Filter ESD Channel ESD Channel PIN A1 C1 A2 C2 B1 B2 A3 C3 A4 C4 DESCRIPTION EMI Filter with ESD Protection for RST Signal EMI Filter with ESD Protection for RST Signal EMI Filter with ESD Protection for CLK Signal EMI Filter with ESD Protection for CLK Signal Device Ground Device Ground EMI Filter with ESD Protection for DAT Signal EMI Filter with ESD Protection for DAT Signal ESD Protection Channel - VCC Supply ESD Protection Channel
Ordering Information
PART NUMBERING INFORMATION
Standard Finish Bumps 10 Package CSP Ordering Part Number1 CM1402-03CS Part Marking CE Lead-free Finish2 Ordering Part Number1 CM1402-03CP Part Marking CE
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
(c) 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
11/02/05
CM1402
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 300 UNITS C mW mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL R1 R2 C VSTANDOFF ILEAK VSIG PARAMETER Resistance of R1 Resistance of R2 Capacitance Stand-off Voltage Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency ZSOURCE = 50, ZLOAD = 50 Cut-off frequency ZSOURCE = 50, ZLOAD = 50 VIN = 2.5VDC, 1MHz, 30mV ac I = 10A VBIAS = 3.3V ILOAD = 10mA ILOAD = -10mA Notes 2,4 and 5 25 10 Notes 2,3,4 and 5 +12 -7 R = 100, C = 20pF R = 47, C = 20pF 77 85 V V MHz MHz kV kV 5.6 -1.5 CONDITIONS MIN 80 38 16 TYP 100 47 20 6.0 0.1 6.8 -0.8 1.0 9.0 -0.4 MAX 120 56 24 UNITS pF V A V V
VESD
VCL
fC1 fC2
Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: The parameters are guaranteed by design.
(c) 2005 California Micro Devices Corp. All rights reserved. 11/02/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
3
CM1402
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. A1-C1 EMI Filter Performance
Figure 2. A2-C2 EMI Filter Performance
(c) 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
11/02/05
CM1402
Performance Information (cont'd)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 3. A3-C3 EMI Filter Performance
Figure 4. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5VDC)
(c) 2005 California Micro Devices Corp. All rights reserved. 11/02/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
5
CM1402
Application Information
The CM1402 provides a bidirectional filter and protector for all the signals and the power line on the SIM (subscriber identity module) card connector. SIM cards are found in all GSM cellular phones and in some other handheld devices or card readers. The ESD diodes protect the controller against possible ESD strikes that may occur when the connector pins are exposed during direct contact, or during insertion of the SIM card into the card slot. The EMI filter suppresses all high-frequency noise, preventing the unwanted EMI signals from both entering and exiting the main board. The signals that interface with the SIM card are the Reset, the Clock and the bidirectional data I/O, as shown in Figure 5.
CM1402
100ohm
SIM Card Connector RST Reset
47ohm
CLK
Clock
Controller with logic level translator
100ohm
I/O
Data I/O
VCC supply (5V, 3.3V or 1.8V) GND
Note: One channel of the CM1402 with a zener diode is not shown on the diagram.
VCC
5V/3V/1.8V
1uF
GND
Figure 5. Typical Application Diagram for the SIM Card Interface For best filter and ESD performance, both GND bumps (B1, B2) of the CM1402 should be directly connected to the Ground plane. A small capacitor of about 1F is required next to the VCC pin of the SIM connector in order to improve stability of the SIM card supply rail. For information on the assembly of the CM1402 to the PCB (printed circuit board), please refer to the Chip Scale Package (CSP) Application Note AP217, or contact factory at 800-325-4966 for technical support.
(c) 2005 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
11/02/05
CM1402
Application Information (cont'd)
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125 - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 240C 260C
Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA.
Figure 6. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (C)
200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0
Figure 7. Eutectic (SnPb) Solder Ball Reflow Profile
(c) 2005 California Micro Devices Corp. All rights reserved. 11/02/05
Figure 8. Lead-free (SnAgCu) Solder Ball Reflow Profile
7
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
CM1402
CSP Mechanical Specifications
CM1402 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document.
B2 B1
Mechanical Package Diagrams
BOTTOM VIEW
A1 C1 B4 B3
OptiGuardTM Coating
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 10 Inches Nom Max
C B A 1 2 3 4
C2 D1 D2 A2
1.915 1.960 2.005 0.0754 0.0772 0.0789 1.285 1.330 1.375 0.0506 0.0524 0.0541 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.180 0.230 0.280 0.0071 0.091 0.0110 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces
0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
SIDE VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1402 Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
POCKET SIZE (mm) B0 X A0 X K0 2.08 X 1.45 X 0.711
Po Top Cover Tape
PART NUMBER CM1402
CHIP SIZE (mm) 1.96 X 1.33 X 0.644
TAPE WIDTH W 8mm
REEL DIAMETER 178mm (7")
QTY PER REEL 3500
P0 4mm
P1 4mm
10 Pitches cumulative tolerance on tape 0.2 mm
Ao W Bo
Ko
For tape feeder reference only including draft. Concentric around B.
Embossment
P1 User direction of feed
Center lines of cavity
Figure 9. Tape and Reel Mechanical Data
(c) 2005 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
11/02/05

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